LTC1644
20
1644f
C1
0.047礔
GND
5V
IN
5V
IN
D1
5V
SENSE
13
5V
OUT
3
3V
IN
LTC1644*
17
3V
OUT
18
3V
SENSE
16
14
GATE
15
8
R4
10&
5V
OUT
1644 F13
R5
1k
R2
0.007&
Q2
IRF7413
D2
NC
Z4
D1, D2: BAV99
Z4: 1PMT5.0AT3
*ADDITIONAL PINS OMITTED FOR CLARITY
PCB EDGE
BACKPLANE
CONNECTOR
BACKPLANE
CONNECTOR
5V
LONG 5V
GROUND
R22 2.74&
C6
0.01礔
C9 0.1礔
PER 10
POWER PINS
Figure 13. No 3.3V Supply Application Circuit
APPLICATIO S I FOR ATIO
U
U
U
Figure 14. BD_SEL# Pushbutton Toggle Switch
GND
LTC1644*
8
1.2k
PUSHBUTTON
SWITICH
100&
5V
IN
1k
GROUND
OFF/ON
5
BD_SEL#
1644 F14
*ADDITIONAL PINS OMITTED FOR CLARITY
PCB EDGE
BACKPLANE
CONNECTOR
BACKPLANE
CONNECTOR
restricts the choice of power MOSFETs to those devices
with very low R
DS(ON)
. Table 9 lists some power MOSFETs
that can be used with the LTC1644.
Power MOSFETs are classified into two categories: stan-
dard MOSFETs (R
DS(ON)
specified at V
GS
= 10V) and logic-
level MOSFETs (R
DS(ON)
specified at V
GS
= 5V). Since
external pass transistors are required for the 3.3V and 5V
supply rails, logic-level power MOSFETs should be used
with the LTC1644.
Overvoltage Transient Protection
Good engineering practice calls for bypassing the supply
rail of any analog circuit. Bypass capacitors are often
placed at the supply connection of every active device, in
addition to one or more large-value bulk bypass capacitors
per supply rail. If power is connected abruptly, the large
bypass capacitors slow the rate of rise of the supply
voltage and heavily damp any parasitic resonance of lead
or PC track inductance working against the supply bypass
capacitors.
The opposite is true for LTC1644 Hot Swap circuits
mounted on plug-in cards. In most cases, there is no
supply bypass capacitor present on the powered 12V
(12V
IN
), 12V (V
EEIN
) of the PCB edge connector or on the
3.3V (3V
IN
) or the 5V (5V
IN
) side of the MOSFET switch. An
abrupt connection, produced by inserting the board into a
backplane connector, results in a fast rising edge applied
on these input supply lines of the LTC1644.
Since there is no bulk capacitance to damp the parasitic
track inductance, supply voltage transients excite para-
sitic resonant circuits formed by the power MOSFET
capacitance and the combined parasitic inductance from
the wiring harness, the backplane and the circuit board
traces. These ringing transients appear as a fast edge on
the input supply lines, exhibiting a peak overshoot up to
2.5 times the steady-state value followed by a damped
发布紧急采购，3分钟左右您将得到回复。
相关PDF资料
LTC1645IS#TRPBF
IC CTRLR SEQ HOTSWAP DUAL 14SOIC
LTC1646IGN#TR
IC CNTRLR HOTSWAP PCIDUAL 16SSOP
LTC1647-1IS8#TRPBF
IC CONTROLLR HOTSWAP DUAL 8-SOIC
LTC1704EGN#TRPBF
IC REG DL BUCK/LINEAR 16SSOP
LTC1966MPMS8#TRPBF
IC RMS/DC CONV MICROPWR 8-MSOP
LTC1967IMS8#TRPBF
IC CONVERTER RMS-DC PREC 8MSOP
LTC1968IMS8#TRPBF
IC CONVERTER RMS-DC PREC 8MSOP
LTC3100EUD#TRPBF
IC REG BUCK/BOOST/LINEAR 16-QFN
相关代理商/技术参数
LTC1644IGN
功能描述:IC CONTROLLER HOT SWAP 20-SSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program 标准包装:119 系列:- 类型:热交换控制器 应用:通用型，PCI Express? 内部开关:无 电流限制:- 电源电压:3.3V，12V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:80-TQFP 供应商设备封装:80-TQFP（12x12） 包装:托盘 产品目录页面:1423 (CN2011-ZH PDF)
LTC1644IGN#PBF
功能描述:IC CONTROLLER HOT SWAP 20-SSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program 标准包装:119 系列:- 类型:热交换控制器 应用:通用型，PCI Express? 内部开关:无 电流限制:- 电源电压:3.3V，12V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:80-TQFP 供应商设备封装:80-TQFP（12x12） 包装:托盘 产品目录页面:1423 (CN2011-ZH PDF)
LTC1644IGN#TR
功能描述:IC CONTROLLER HOT SWAP 20-SSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program 标准包装:119 系列:- 类型:热交换控制器 应用:通用型，PCI Express? 内部开关:无 电流限制:- 电源电压:3.3V，12V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:80-TQFP 供应商设备封装:80-TQFP（12x12） 包装:托盘 产品目录页面:1423 (CN2011-ZH PDF)
LTC1644IGN#TRPBF
功能描述:IC CONTROLLER HOT SWAP 20-SSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program 标准包装:119 系列:- 类型:热交换控制器 应用:通用型，PCI Express? 内部开关:无 电流限制:- 电源电压:3.3V，12V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:80-TQFP 供应商设备封装:80-TQFP（12x12） 包装:托盘 产品目录页面:1423 (CN2011-ZH PDF)
LTC1645CS
功能描述:IC CTRLR SEQ HOTSWAP DUAL 14SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:100 系列:- 类型:热插拔开关 应用:通用 内部开关:是 电流限制:可调 电源电压:9 V ~ 13.2 V 工作温度:-40°C ~ 150°C 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-TDFN-EP（3x3） 包装:管件
LTC1645CS#PBF
功能描述:IC CTLR HOT SWAP SEQ DUAL 14SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 标准包装:50 系列:- 类型:热交换控制器 应用:-48V 远程电力系统，AdvancedTCA ? 系统，高可用性 内部开关:无 电流限制:可调 电源电压:11.5 V ~ 14.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:10-TFSOP，10-MSOP（0.118"，3.00mm 宽） 供应商设备封装:10-MSOP 包装:管件
LTC1645CS#TR
功能描述:IC CTRLR SEQ HOTSWAP DUAL 14SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:100 系列:- 类型:热插拔开关 应用:通用 内部开关:是 电流限制:可调 电源电压:9 V ~ 13.2 V 工作温度:-40°C ~ 150°C 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-TDFN-EP（3x3） 包装:管件
LTC1645CS#TRPBF
功能描述:IC CTRLR SEQ HOTSWAP DUAL 14SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:100 系列:- 类型:热插拔开关 应用:通用 内部开关:是 电流限制:可调 电源电压:9 V ~ 13.2 V 工作温度:-40°C ~ 150°C 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-TDFN-EP（3x3） 包装:管件
